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 BAS381 / 382 / 383
Vishay Semiconductors
Small Signal Schottky Diodes
Features
* Integrated protection ring against static discharge e2 * Low capacitance * Low leakage current * Low forward voltage drop * Very low switching time * Lead (Pb)-free component * Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
9612315
Applications
* General purpose and switching Schottky barrier diode * HF-Detector * Protection circuit * Diode for low currents with a low supply voltage * Small battery charger * Power supplies * DC / DC converter for notebooks
Mechanical Data
Case: MicroMELF Glass case Weight: approx. 12 mg Cathode Band Color: Black Packaging Codes/Options: TR3 / 10 k per 13" reel (8 mm tape), 10 k/box TR / 2.5 k per 7" reel (8 mm tape), 12.5 k/box
Parts Table
Part BAS381 BAS382 BAS383 Type differentiation VR = 40 V VR = 50 V VR = 60 V Ordering code BAS381-TR3 or BAS381-TR BAS382-TR3 or BAS382-TR BAS383-TR3 or BAS383-TR Remarks Tape and Reel Tape and Reel Tape and Reel
Absolute Maximum Ratings
Tamb = 25 C, unless otherwise specified Parameter Reverse voltage Test condition Part BAS381 BAS382 BAS383 Peak forward surge current Repetitive peak forward current Forward continuous current tp = 1 s Symbol VR VR VR IFSM IFRM IF Value 40 50 60 500 150 30 Unit V V V mA mA mA
Document Number 85503 Rev. 1.9, 07-Mar-06
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BAS381 / 382 / 383
Vishay Semiconductors Thermal Characteristics
Tamb = 25 C, unless otherwise specified Parameter Junction to ambient air Junction temperature Storage temperature range Test condition on PC board 50 mm x 50 mm x 1.6 mm Symbol RthJA Tj Tstg Value 320 125 - 65 to + 150 Unit K/W C C
Electrical Characteristics
Tamb = 25 C, unless otherwise specified Parameter Forward voltage Test condition IF = 0.1 mA IF = 1 mA IF = 15 mA Reverse current Diode capacitance VR = VRmax VR = 1 V, f = 1 MHz Symbol VF VF VF IR CD Min Typ. Max 330 410 1000 200 1.6 Unit mV mV mV nA pF
Typical Characteristics
Tamb = 25 C, unless otherwise specified
14
1000
P - Reverse Power Dissipation (mW) R
V R = 60 V
I F - Forward Current (A)
12
R thJA = 540 K/W
10 8 6 4
100 Tj =150 C 10 Tj = 25 C
PR - Limit at 100 % VR R R
1
PR - Limit at 80 % VR
2 0 25 50 75 100 125 150
0.1
0.01 0
15796
0.5
1
1.5
2.0
15794
Tj - Junction Temperature (C)
V F - Forward Voltage (V)
Figure 1. Max. Reverse Power Dissipation vs. Junction Temperature
Figure 3. Forward Current vs. Forward Voltage
1000
2.0
CD - Diode Capacitance (pF)
V R = VRRM
I R - Reverse Current (A)
100
1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2
f = 1 MHz
10
1
0.1 25
15795
0
50 75 100 125 150
15797
0.1
1
10
100
Tj - Junction Temperature (C)
V R - Reverse Voltage (V)
Figure 2. Reverse Current vs. Junction Temperature
Figure 4. Diode Capacitance vs. Reverse Voltage
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Document Number 85503 Rev. 1.9, 07-Mar-06
BAS381 / 382 / 383
Vishay Semiconductors
0.71
1.3
1.27
0.152
9.9 25 0.355
10
2.5
95 10329
24
Figure 5. Board for RthJA definition (in mm)
Package Dimensions in mm (Inches)
1. 35 la (0. ss 05 3)
Cathode indification 1 (0.039) surface plan
Glass case MicroMELF
2.0 (0.079) 1.8 (0.071)
0.25 (0.010) 0.15 (0.006)
1.2 (0.047) 1.1 (0.043)
> R 2.5 (R 0.098) Glass
ISO Method E
Reflow Soldering
1.2 (0.047) 1.4 (0.055)
Wave Soldering
0.8 (0.031) 0.8 (0.031) 2.4 (0.094)
Document No.: 6.560-5007.01-4 Rev. 11, 07.Feb.2005 9612072
0.8 (0.031)
0.9 (0.035) 1.0 (0.039) 2.8 (0.110)
Document Number 85503 Rev. 1.9, 07-Mar-06
surface plan 0.6 (0.024)
0.9 (0.035)
G
<
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BAS381 / 382 / 383
Vishay Semiconductors Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
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Document Number 85503 Rev. 1.9, 07-Mar-06
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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